Glassclad EG – 20% Solids In Xylene (PS225)

Glassclad EG 20% Solids In Xylene

PS225 is a thermally stable resin which forms a moderately flexible film with excellent adhesion and low chloride content. It provides an oxidation and mechanical barrier for resistors and circuit boards. Part application is by spraying or dipping. Cure is 20 minutes at 220°C.

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For international ordering, contact your International Distributor.

For sample requests, please contact your Regional Sales Representative